Posts Tagged ‘3D NAND’

Micron 3D NAND Technology – 4,300 MBps

micron, 3d nand

Micron has introduced two new tech products: a tiny flash storage device for phones and a big memory chip for Nvidia GPUs.

Micron, which makes and sells SSDs, created a flash chip that’s super small but packs a punch. It’s like a supercharged version of the standard UFS 4.0 device, only about the size of a fingernail (9 x 13 mm). This tiny chip can hold up to 1 TB of data using Micron’s fancy 3D NAND technology. It’s super speedy, reading and writing data much faster than older models. This means your smartphone apps can load quicker and run smoother. Plus, it can be used in cars too.

Mark Montierth, from Micron, said their new chip is all about making smartphones faster and more efficient. With this new technology, your phone can handle fancy AI apps much quicker, making chatting with bots smoother.

The new chip also comes with some cool new features:

  1. High-Performance Mode (HPM): This makes sure your phone runs smoothly even when you’re doing a lot at once.
  2. One Button Refresh (OBR): This helps keep your phone clean and running like new.
  3. Zoned UFS (ZUFS): This helps your phone’s storage last longer by managing data better.

Micron is already sending out samples of their new chip, which comes in different sizes. And guess what? Big phone companies like HONOR and Samsung are already using Micron’s new tech in their latest smartphones.

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Micron Technology Announces 232 Layer 3D NAND by End of 2022

Micron announced the industry’s first 3D NAND memory device with 232 layers on Thursday. The company intends to use its new 232-layer 3D NAND products for a variety of applications, including solid-state drives, and expects to begin mass production of such chips in late 2022.

micron, 3d nand, 232 layer

Micron’s 232-layer 3D NAND device has a raw capacity of 1Tb and a 3D TLC architecture (128GB). The chip is based on Micron’s CMOS under array (CuA) architecture and stacks two arrays of 3D NAND on top of each other using the NAND string stacking technique.

The CuA design, combined with 232 layers of NAND, will significantly reduce the die size of Micron’s 1Tb 3D TLC NAND memory, allowing Micron to price devices featuring these chips more aggressively or simply increase its margins.

Micron did not specify I/O speeds or the number of planes in its new 232L 3D TLC NAND IC, but it did state that the new memory will outperform existing 3D NAND devices, which will be especially useful for next-generation SSDs with a PCIe 5.0 interface.

Speaking of SSDs, Micron’s executive vice president of technology and products, Scott DeBoer, stated that the company has worked closely with developers of in-house and third-party NAND controllers (for SSDs and other NAND-based storage devices) to ensure proper support for the new type of memory (and make sure those upcoming drives end up in our best SSDs list).

“We optimized [232-layer 3D NAND] technology around what we need to make the world’s fastest managed NAND and both datacenter and client SSD products,” said DeBoer. “The combination of controllers, both internal and external, has been a strong element of our vertical product integration focus to ensure that we have optimized NAND and controller technology for what we need to deliver future leadership products.”

Among the benefits of its 232-layer 3D TLC NAND are Micron mentioned lower power consumption compared to previous-generation nodes, which will be another advantage given Micron’s historical focus on mobile applications and relationships with device makers.

Given that Micron will begin production of 232-layer 3D TLC NAND devices in late calendar 2022, we can expect SSDs powered by the new memory to arrive in 2023.

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What Is 3D NAND Flash Memory?

3D NAND, flash drive

3D NAND was developed in response to the scaling limitations of 2D NAND memory.

The layers in 3D NAND were flipped from horizontal to vertical orientation and strings of them were built to form a tower. By changing the direction of how the cells are configured created opportunity to increase storage capacity, reduce size of the storage area and reduce the power consumption to access the cells.

Honestly, it’s a complicated explanation to describe the changes between 2D and 3D NAND, but we found this awesome video from TechTarget. The video is very direct and to the point without over complicated explanations. Please watch it. 2min 20 seconds long.

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