The Justice Department recently made an announcement about a settlement agreement with Micron Technology Inc., a company that makes computer parts. The settlement is related to a violation of a law called the Immigration and Nationality Act (INA), where Micron discriminated against a U.S. citizen by not hiring him for a job and instead hiring someone with a temporary visa.

The Department started investigating Micron when a U.S. citizen complained that he was unfairly denied a job because of his citizenship status. The Department found out that Micron had wrongly preferred a temporary visa worker for the job, without properly considering the qualifications of the U.S. citizen. The INA, which is a federal civil rights law, says that employers cannot discriminate against job applicants based on their citizenship, immigration status, or national origin during any stage of the hiring process, unless required by law.

As part of the settlement, Micron has to pay a civil penalty to the United States and give back pay totaling $85,000 to the worker who was affected by the discrimination. Micron also has to train its staff on the INA’s anti-discrimination provision, change its policies and procedures, and be monitored by the Department for two years.

The INA is enforced by a section of the Civil Rights Division called the Immigrant and Employee Rights Section (IER). This law prohibits discrimination in various employment practices, such as hiring, firing, recruitment, and referral for a fee, based on citizenship status and national origin. It also addresses unfair documentary practices, as well as retaliation and intimidation.

Assistant Attorney General Kristen Clarke of the Justice Department’s Civil Rights Division emphasized that companies cannot unlawfully discriminate against job applicants based on their citizenship or immigration status, and that the Department will continue to hold companies accountable for violating this federal civil rights law, regardless of their size.

In conclusion, the Justice Department reached a settlement agreement with Micron due to their violation of the INA by discriminating against a U.S. citizen during the hiring process. The settlement includes financial penalties, back pay to the affected worker, and requirements for Micron to train their staff, change policies, and be monitored by the Department. The INA, enforced by the Civil Rights Division’s Immigrant and Employee Rights Section, prohibits discrimination based on citizenship status and national origin in various employment practices.

Micron memory refers to a type of computer memory produced by Micron Technology, a global leader in semiconductor and memory solutions. Micron memory encompasses a range of memory products including dynamic random-access memory (DRAM) and NAND USB flash memory, which are essential components in various computing devices such as smartphones, computers, servers, and data centers.

DRAM is a type of volatile memory that provides fast and temporary storage for data that is being actively used by a computer. It is widely used in applications that require high-speed data processing, such as gaming, multimedia, and cloud computing.

NAND flash memory, on the other hand, is a non-volatile memory that retains data even when the power is turned off. It is commonly used for long-term data storage in devices like solid-state drives (SSDs), memory cards, and USB drives.

Micron’s memory solutions are known for their high performance, reliability, and energy efficiency, and are used by a wide range of industries, including automotive, consumer electronics, industrial, and enterprise markets, to enable advanced computing and data storage capabilities.

Kioxia Holdings Corporation, abbreviated as Kioxia and stylized as KIOXIA, is a Japanese-American multinational computer memory manufacturer headquartered in Tokyo. In June 2018, Toshiba Memory Corporation was spun off from the Toshiba conglomerate. On March 1, 2019, it became a wholly owned subsidiary of Toshiba Memory Holdings Corporation and was renamed Kioxia in October 2019

While still a subsidiary of Toshiba, the company was credited with inventing flash memory in the early 1980s. The company is expected to have 18.3% of the global revenue share for NAND flash solid-state drives in the second quarter of 2021. Kioxia Corporation’s parent company is this one.

Fujio Masuoka, an engineer at Kioxia predecessor Toshiba, invented flash memory in 1980, and Masuoka and his colleagues presented their NOR flash invention in 1984.

Toshiba Corporation completed its acquisition of OCZ Storage Solutions in January 2014, renaming it OCZ and making it a Toshiba brand.

Toshiba Memory Corporation was spun off from Toshiba Corporation on June 1, 2018, due to heavy losses incurred by the bankruptcy of former parent company Toshiba’s Westinghouse subsidiary over nuclear power plant construction at Vogtle Electric Generating Plant in 2016. Toshiba retained 40.2% ownership of the new company. Toshiba’s memory businesses were all merged into the new company. On March 1, 2019, Toshiba Memory Corporation became a subsidiary of the newly formed Toshiba Memory Holdings Corporation.

Kioxia suffered a power outage at one of its factories in Yokkaichi, Japan, in June 2019, resulting in the loss of at least 6 exabytes of flash memory, with some sources estimating the loss to be as high as 15 exabytes. Western Digital used (and continues to use) Kioxia’s facilities to manufacture its own flash memory chips.

UFS 4.0 Has 2,800MB/Second Write Speeds

Samsung claims to have created the industry’s highest performing Universal Flash Storage (UFS). With read speeds of up to 4,200MB/s and write speeds of up to 2,800MB/s, UFS 4.0 is twice as fast as the previous generation.

Not only is UFS 4.0 faster than previous generations, but Samsung claims it also consumes less power. As a result, the company claims that it will be at the heart of future mobile storage solutions, having a dramatic impact on smartphone performance as well as having a significant impact on augmented reality (AR) and virtual reality (VR) hardware.

According to Samsung, UFS 4.0 comes in a small package that measures 11mm by 13mm by 1mm and can support capacities of up to 1TB. This 1 TB has a sequential read speed of 6 MB/s per mA, a 46 percent improvement over the previous generation’s power consumption.

“UFS 4.0 offers up to 23.2Gbps per lane, which is double that of the previous UFS 3.1,” Samsung claims. “That much bandwidth is ideal for 5G smartphones, which require massive amounts of data processing, and it is also expected to be used in future automotive applications, AR, and VR.”

The performance is also impressive, with a sequential read speed of up to 4,200MB/s and a sequential write speed of up to 2,800MB/s promised. The previous generation, UFS 3.1, could promise write speeds of up to 1,200 MB/s. More than doubling the previous generation’s speed while using nearly half the power is likely to have a significant positive impact on device performance.

JEDEC, the Solid State Technology Association, an independent semiconductor engineering trade organization and standardization body, has approved the UFS 4.0 standard specification. Samsung says mass production of UFS 4.0 storage will begin in the third quarter of 2022, and that it is collaborating with smartphone and consumer device manufacturers from around the world to create an ecosystem of support for UFS 4.0 to make market adoption easier and faster.

3D NAND was developed in response to the scaling limitations of 2D NAND memory.

The layers in 3D NAND were flipped from horizontal to vertical orientation and strings of them were built to form a tower. By changing the direction of how the cells are configured created opportunity to increase storage capacity, reduce size of the storage area and reduce the power consumption to access the cells.

Honestly, it’s a complicated explanation to describe the changes between 2D and 3D NAND, but we found this awesome video from TechTarget. The video is very direct and to the point without over complicated explanations. Please watch it. 2min 20 seconds long.

Micron Technology, Inc. (Nasdaq: MU) has announced the availability of a sample of the world’s first vertically-integrated 176-layer NAND solid-state drive (SSD) for data center applications. This new data center SSD features Micron’s industry-leading NAND with 176 layers of storage cells and proven CMOS-under-the-array technology for an ultra-efficient design.

Last year, organizations that used high encryption standards for data at rest and in motion paid 29.4 percent less for a data breach than organizations that used low or no standard encryption. Micron SSDs include self-encrypting drive functionality and Microsoft eDrive options to help protect against data breaches and tailor security to specific data protection needs.

M&G Investment Management Ltd. recently bought more shares of a company called Silicon Motion Technology Co. This company makes small computer parts used in things like phones and cameras. Even though the company didn’t make as much money as people thought it would last year, it still made a lot of money. M&G Investment Management Ltd.’s purchase shows that they believe Silicon Motion Technology Co. will continue to grow in the future.

Investors should pay attention to Silicon Motion Technology Co.’s ( a.ka. SMI ) plans for new products, especially for things like smartphones. If they don’t make new and popular products, they might not make as much money in the future. However, the company is trying new things to improve, so it might be a good investment in the long term.

Silicon Motion Technology is a multinational company that designs and develops microcontrollers for solid-state drives (SSDs), embedded multimedia cards (eMMCs), and other NAND flash memory applications. The company was founded in 1995 and is headquartered in Taiwan, with additional offices and facilities located in China, South Korea, Japan, and the United States. Silicon Motion’s products are used in a wide range of consumer electronics devices, including smartphones, tablets, digital cameras, and portable media players, as well as in industrial and automotive applications.

Silicon Motion is known for its high-performance integrated circuits, which are used to control and manage the storage of data in SSDs and other flash memory devices. The company’s products are designed to be fast, reliable, and energy-efficient, making them ideal for use in mobile devices and other battery-powered applications. In addition to its microcontroller products, Silicon Motion also offers software solutions for managing and optimizing SSD performance, as well as hardware products for secure data storage and wireless connectivity. The company’s focus on innovation and customer satisfaction has helped it to become a leader in the fast-growing market for flash memory technology.

M&G Investment Management Ltd. is a UK-based investment management company that offers a range of investment services to individual and institutional clients. The company was founded in 1931 and is headquartered in London, with additional offices located throughout Europe and Asia. M&G Investment Management Ltd. manages a diverse range of investment products, including mutual funds, exchange-traded funds (ETFs), and separately managed accounts, with a focus on delivering strong long-term returns for its clients.

M&G Investment Management Ltd.’s investment philosophy is based on a disciplined, research-driven approach that emphasizes risk management and a long-term investment horizon. The company’s investment process is designed to identify undervalued assets with strong fundamentals and the potential for future growth. M&G Investment Management Ltd. employs a team of experienced investment professionals who use a combination of quantitative and qualitative analysis to evaluate investment opportunities across a range of asset classes and geographies. With a focus on sustainability and responsible investing, M&G Investment Management Ltd. is committed to integrating environmental, social, and governance (ESG) considerations into its investment process to help create a more sustainable future for all.

Reasons For Purchase

There are several reasons why M&G may purchased Silicon Motion Technology. First, the company is well-positioned to benefit from the growing demand for flash memory and storage solutions in the data center, mobile, and automotive markets. Silicon Motion’s NAND flash controllers are used in a variety of applications, including solid-state drives (SSDs), USB flash drives, and memory cards.

Nexcopy Incorporated, a California based manufacturing company is a prime example of business using USB flash drives and memory cards who employ advanced technologies offered by SMI in their microcontroller products.

Second, Silicon Motion has a strong track record of innovation and product development. The company invests heavily in research and development (R&D), and has a large portfolio of intellectual property (IP). This gives SMI a competitive advantage in the market and allows it to develop new products and technologies that meet the evolving needs of its customers.

Third, Silicon Motion has a solid financial position and a strong balance sheet. The company has a history of generating strong cash flows, which it has used to reinvest in the business and pay dividends to shareholders. This financial stability makes Silicon Motion an attractive investment opportunity for M&G.

Finally, M&G’s investment in Silicon Motion is consistent with its strategy of investing in companies that are well-positioned to benefit from disruptive technology trends. As the world becomes increasingly digital, the demand for storage and memory solutions is only going to grow. By investing in Silicon Motion, M&G is positioning itself to benefit from this growth and to generate strong returns for its investors.

KV-CSD is an acronym for Key Value Store Computational Storage Device and Hynix a NAND memory manufacturer is directing their technology towards this storage approach.

Here at GetUSB.info we focus on NAND memory and typically look at the write speeds of devices. However, for data centers and analytic companies, the ability to retrieve data is more important. The ability to read the index of where data is and then retrieve it is a key part for data analytics and how companies can react to queries.

Just imagine something like an insurance company holding millions of policies and related customers who need to search and sort through large amounts of data quickly while servicing customers… now imagine that same requirement during a natural disaster where the incoming requests skyrocket. Quickly finding the data needed becomes a mission critical task.

Traditional methods for indexing are “relationship databases” and done on a file-record level. A file-record indexing approach uses predefined data structures in the database as a series of tables containing data about the type of information related to the files, like meta-data tags.

In contrast, key–value systems treat the data as a single transparent collection which can have many different values for each record in a column structure. The indexing values in a column provide a more efficient method to search the indexed data to more efficiently find the requested data.

What Hynix is doing is introducing a method to index content on the fly (as it’s being written) into NAND memory so when a subsequent search is performed the result will present itself more quickly.

Hynix teamed with Los Alamos National Laboratory in Northern New Mexico who is a multidisciplinary research institution engaged in strategic science on behalf of national security, and managed by Triad, a public service-oriented, national security science organization equally owned by its three founding members: Battelle Memorial Institute (Battelle), the Texas A&M University System (TAMUS), and the Regents of the University of California (UC) for the Department of Energy’s National Nuclear Security Administration.

Los Alamos enhances national security by ensuring the safety and reliability of the U.S. nuclear stockpile, developing technologies to reduce threats from weapons of mass destruction, and solving problems related to energy, environment, infrastructure, health, and global security concerns.

Reference material: Los Alamos National Laboratory website page about collaboration.

Micron announced the industry’s first 3D NAND memory device with 232 layers on Thursday. The company intends to use its new 232-layer 3D NAND products for a variety of applications, including solid-state drives, and expects to begin mass production of such chips in late 2022.

Micron’s 232-layer 3D NAND device has a raw capacity of 1Tb and a 3D TLC architecture (128GB). The chip is based on Micron’s CMOS under array (CuA) architecture and stacks two arrays of 3D NAND on top of each other using the NAND string stacking technique.

The CuA design, combined with 232 layers of NAND, will significantly reduce the die size of Micron’s 1Tb 3D TLC NAND memory, allowing Micron to price devices featuring these chips more aggressively or simply increase its margins.

Micron did not specify I/O speeds or the number of planes in its new 232L 3D TLC NAND IC, but it did state that the new memory will outperform existing 3D NAND devices, which will be especially useful for next-generation SSDs with a PCIe 5.0 interface.

Speaking of SSDs, Micron’s executive vice president of technology and products, Scott DeBoer, stated that the company has worked closely with developers of in-house and third-party NAND controllers (for SSDs and other NAND-based storage devices) to ensure proper support for the new type of memory (and make sure those upcoming drives end up in our best SSDs list).

“We optimized [232-layer 3D NAND] technology around what we need to make the world’s fastest managed NAND and both datacenter and client SSD products,” said DeBoer. “The combination of controllers, both internal and external, has been a strong element of our vertical product integration focus to ensure that we have optimized NAND and controller technology for what we need to deliver future leadership products.”

Among the benefits of its 232-layer 3D TLC NAND are Micron mentioned lower power consumption compared to previous-generation nodes, which will be another advantage given Micron’s historical focus on mobile applications and relationships with device makers.

Given that Micron will begin production of 232-layer 3D TLC NAND devices in late calendar 2022, we can expect SSDs powered by the new memory to arrive in 2023.

Help! Is a TF card or microSD card required for my device? What IS the difference?

When it comes to memory cards, the market offers a plethora of options aimed at various devices. TF cards and microSD cards are two of the most well-known of these options. These cards are used as primary or secondary storage devices in a wide range of devices.

Having said that, there is some misunderstanding about what a TF card is. Is there a distinction between a TF card and a microSD card? Is it the same thing? Which one should I choose?

What Is a TF Card?

In 2004, Motorola and SanDisk introduced TransFlash (TF) cards as a replacement for SD cards. Secure Digital cards (SD cards), as you know, are memory cards used in digital cameras and other devices which require portable storage. Although SD cards are the most widely used storage format, they are larger and more cumbersome than a TF card.

TF cards were designed to be smaller and more compact than SD cards while still retaining SD card functionality. This means you can use a TF memory card in your digital camera or any other device that accepts an SD card with the help of an SD card adapter.

What is a MicroSD Card?

MicroSD cards are simply rebranded TF cards. When Motorola and SanDisk released the TF card in 2004, it was released as a separate standalone product. Aside from the fact that TF cards supported the same standard specifications as SD cards (except for the size), they were a distinct, non-standardized product class.

The SD Association, which is the governing body over the Secure Digital specifications and compliance guidelines, adopted TF cards as microSD cards to standardize these flash memory cards.

So, microSD cards are TF cards in disguise.

TF Card vs. microSD Card: What’s the Difference?

There are no distinctions between TF cards and microSD cards. Both can be used interchangeably. For example, if you have a TF card but your smartphone only supports microSD cards, you can use your TF card. It will work perfectly because it adheres to the same standard.

Which Card to Pick Up?

If you need a memory card for your digital camera or older gadgets but don’t need one for your smartphone, a full-sized SD card is the way to go.

On the contrary, if you need a card for your smartphone alone, you have no other option than a microSD card.

Finally, get a microSD card with an SD adapter so that you can use your card in both your smartphone and other devices. Because MicroSD cards use the same standard interface as SD cards, they can be used in place of SD cards with the help of an SD card adapter.

The latest innovation from Nexcopy, the 16-target SD Card Duplicator, redefines efficiency by allowing users to copy 1GB of data every 30 seconds. With its enhanced copy speeds, this cutting-edge device is a key product for those needing to perform Secure Digital duplication.

Manufactured by Nexcopy Inc., a Southern California based technology company, the SD160PC sets a new standard for SD Card Duplicators. Designed to be connected to a computer, this device boasts the Drive Manager software, exclusively developed by Nexcopy. This software offers users a comprehensive array of features, enabling them to execute even the most intricate data duplication projects with ease.

Key features of the SD Card Duplicator:

• Rapid duplication of 1GB of data to all sockets every 30 seconds.
• Ability to read CID numbers from Secure Digital cards, enhancing security measures.
• Drive Manager software equipped with six copy modes, catering to diverse user requirements.
• Support for any file format, with compatibility dependent on the chosen copy mode.
• Password control for Admin area of software providing a level of control between management and production teams.

One notable capability of the SD160PC is its ability to read CID numbers from Secure Digital media. The CID number, a unique identifier assigned by the card manufacturer and stored in read-only memory, adds an extra layer of security for encrypted content written to Secure Digital media. Nexcopy facilitates easy access to CID numbers for each card, offering the option to download and export this information to a .csv file for further analysis or record-keeping purposes.

For those interested in witnessing the SD160PC in action, Nexcopy provides a live speed test video on the product page. This demonstration showcases the remarkable copy speed and efficiency of the SD Card Duplicator system, providing prospective users with a firsthand look at its performance capabilities.

The SD160PC is currently available for purchase and shipping directly from Nexcopy or through their extensive network of authorized resellers worldwide. Whether for commercial duplication needs or personal data management, the SD160PC offers unparalleled speed, reliability, and functionality, making it the ideal choice for users seeking top-of-the-line SD card duplication solutions.

UPDATE:

Since this press release from March 2022, Nexcopy has since updated their software to support the writing of CID numbers to SD cards in conjunction with the ability to read CID values from the card. The CID number or Card Identification Number is a value written into read-only memory (ROM) where the value cannot be edited, duplicated or copied by any device.

The ability to write the CID value is not a universal solution. The solution requires specific vendor commands to be sent to the individual SD card in order for the value to be written. Nexcopy offers Secure Digital media which supports the writing of CID values, thus providing a turn key solution for those needed to do so.

What is a CID number?

The CID (Card Identification) of a Secure Digital (SD) card is a unique identifier embedded within the card’s read-only memory by the manufacturer. It serves as a distinct serial number for the card and typically consists of specific information such as the card’s manufacturing date, manufacturer ID, and other proprietary data.

The CID number is accessed through a hardware chip and vendor command on a compatible host system, such as an SD card reader or a specialized device like the SD160PC SD Card Duplicator mentioned in the provided text. This unique identifier can be valuable for various purposes, including device authentication, data encryption, and tracking of individual SD cards within a system.

CID numbers are not visible to end-users in regular circumstances but can be accessed programmatically through software interfaces or tools provided by the manufacturer. Additionally, certain SD card management software may offer functionalities to read and export CID numbers for administrative or security purposes.

The CID of a Secure Digital card is a vital piece of information used for identification and management purposes, embedded within the card’s read-only memory during the manufacturing process.

the 16-target SD Card Duplicator by Nexcopy represents a leap forward in data duplication technology. With its lightning-fast copy speeds, comprehensive software features, and robust security measures, the SD160PC stands as the pinnacle of efficiency and performance in the realm of Secure Digital duplication.

Nexcopy announced the SD Card Duplicator product release through PRLeap Press Service on March 30,2022